Please use this to check the implementation status of BGA components and to identify any defects!
Our company offers X-ray inspection services using the X-ray inspection device "FX-300tRX" with CT functionality. We will check and analyze the soldering condition using the X-ray inspection device with CT functionality. The inspection images (CT images are video files) will be written to a DVD and provided to you. Please use this for confirming the mounting condition of BGA components and for identifying any defects. It can also be used to check the solder filling rate of inserted components. 【Features of FX-300tRX】 ■ Geometric magnification of 1000 times ■ Capable of canceling backside information using "X-ray stereo method" ■ Flat panel can be observed at a 60° tilt ■ Points do not shift even if the camera is tilted ■ Capable of displaying tomographic information (approximately 3-5mm up and down can be divided into 100 parts) *For more details, please refer to the PDF document or feel free to contact us.
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basic information
For more details, please refer to the PDF document or feel free to contact us.
Price information
CT scan: 10,000 yen Conventional X-ray: 4,000 yen
Price range
P1
Delivery Time
P1
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
Detailed information
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CT function The stereo CT function divides the upper and lower parts of the implementation board into approximately 3 to 5 mm in 100 segments, allowing for the display of tomographic information.
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CT function The stereo CT function divides the upper and lower parts of the implementation board into approximately 3 to 5 mm in 100 segments, allowing for the display of tomographic information.
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Inclined shooting The flat panel tilts at 60°, making it effective for detecting un-soldered areas and solder cracks.
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Company information
The impetus for our work on BGA rework was "environmental protection." Starting around 2002, we began to see a significant number of circuit board repairs that were impossible to fix while conducting mobile phone repair operations. When BGA (IC) was incorporated into mobile phones, adhesive (underfill) was used as a measure to prevent solder peeling. This adhesive reinforces the bonding between the circuit board and the IC, but due to aging and usage conditions such as drops, it can surprisingly crack easily. Later, these cracks can erode the solder of the IC, leading to functional failures. Since mobile phone circuit boards have many functions, the disposal cost for a single unit can be enormous. If IC replacement becomes possible, repairs can be conducted with just the cost of the IC and its replacement, allowing other components to be reused, which we believe connects this recycling technology to "environmental protection." Our company has been committed to creating a more environmentally friendly world through circuit board modification, repair, BGA reballing, and component regeneration long before the term SDGs became widely recognized, emphasizing the importance of the global environment.