Highly anticipated as a next-generation marker! Minimum 6 microns. A high-speed laser system that minimizes thermal impact and allows for processing.
【Main Features】 ■ Marking Area: 75mm (170mm) ■ Spot Size: <25 microns (6 microns) ■ Drawing Speed: 300mm per second (2m per second) ■ Laser Output: 1W ■ Wavelength: 355nm ■ Dimensions: 760×460×610mm (H) ■ Operating Voltage: 100-250VAC/50-60Hz <700W ■ Spot size, marking area, and drawing speed can be changed according to options.
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basic information
This is a high-speed laser marking system using an LD-pumped solid-state laser with a wavelength of 355nm. By using 355nm light, it enables fine and sharp marking. Additionally, this ultraviolet marking laser system can perform ultraviolet ablation and engraving on many materials, as well as scribing on sapphire glass, removing ITO films, and drilling.
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Applications/Examples of results
Main processing targets ■wires ■metals ■sapphire ■glass ■diamond ■polyamides ■PCBs ■coatings ■ITO removal ■silicon wafers ■ceramics ■plastics ■fiber ■paper etc.
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Company information
We handle processing equipment, inspection devices, and peripheral devices based on laser systems. We also offer a wide range of other measuring instruments and equipment for synchronization with other devices. If you are looking for equipment for production facilities, research facilities, etc., please feel free to contact us.