Socket for burn-in testing of QFN semiconductor packages.
790 Series Open Top Type Burn-In Socket
Test socket for QFN packages compatible with narrow pitch. For improving the yield of semiconductor components.
The QFN semiconductor package is essential for miniaturizing precision equipment. The Burn-In Socket 'Series 790' allows for quality testing to be conducted with higher precision and efficiency to avoid defective products. - Supports terminal pitches of 0.4, 0.5, 0.8, and 1.0 mm - Open-top type, ideal for both automatic and manual insertion/removal - Usable in harsh environmental tests such as HAST and THB - Improves positioning accuracy for fine-pitch devices These features enhance the accuracy of burn-in testing.
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basic information
【Other Features】 ■Supported device size: 3.3mm to 12x12mm ■Adopts a movable guide system to improve positioning accuracy for fine-pitch devices ■Allows for heat dissipation or contact with ground pads of the device
Price information
Prices range from ¥2,000 to ¥5,000. Prices may vary depending on the variety and quantity, so please feel free to contact us.
Price range
P1
Delivery Time
P4
※Delivery times may vary depending on quantity and variety, so please feel free to contact us.
Applications/Examples of results
Burn-in testing, various environmental tests, various programming.
Line up（1）
| Model number | overview |
|---|---|
| 790 Series | QFN Open Top Type Burn-In Socket |
Company information
SensorTa Technologies Japan, Inc., QINEX Division, joined the North American Boyd Corp group in August 2022 and became Boyd Technologies Japan LLC.
