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  6. Insulating and heat-dissipating materials, semiconductor devices, insulating and heat-dissipating pads.

Insulating and heat-dissipating materials, semiconductor devices, insulating and heat-dissipating pads.

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last updated:Jul 31, 2019

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High electrical durability! Excellent mechanical durability and puncture resistance!

Semiconductor device insulation and heat dissipation pads are used in many electronic devices as an alternative to traditional mica insulation sheets, thanks to their excellent thermal and electrical properties. Additionally, they are reinforced with a fiberglass cloth layer, enhancing their resistance to breakage, penetration, and bending. Adhesive tape (with PSA) can be added on one side or both sides as an option. We offer a wide variety of shapes to accommodate diverse applications. For more details, please contact us or refer to our catalog.

    Composite Materials
19.thermal_insulator_pads.jpg

Insulating and heat-dissipating materials, semiconductor devices, insulating and heat-dissipating pads.

19.thermal_insulator_pads.jpg
19.thermal_insulator_pads.jpg
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【Features】 ○ Used in many electronic devices due to temperature and electrical characteristics ○ Reinforced with glass fiber cloth layer for enhanced resistance to breaking, penetration, and bending ○ Optional adhesive tape (with PSA) can be added to one or both sides ○ Available in a wide variety of shapes to accommodate diverse applications ○ High electrical durability ○ Excellent mechanical durability and puncture resistance ○ High-temperature durability certified by UL fire class ○ Acrylic PSA option (adhesive tape can be added) ○ Long lifespan with no corrosion to metals ○ ROHS compliant 【Product Specifications】 ○ Compatible semiconductor packages: TO-220/TO-3/TO-3P/TO-220-BH/TO-3P-BH ○ Sheet thickness: TO-220/TO-3/TO-3P 0.3mm, TO-220-BH/TO-3P-BH 0.5mm ○ Sheet color: gray ● For more details, please contact us or refer to the catalog.

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Insulating and heat-dissipating material, semiconductor device, insulating and heat-dissipating pad.

Insulating and heat-dissipating material, semiconductor device, insulating and heat-dissipating pad.

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Electronic Components and Semiconductors

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Since our company's establishment in 1985, we have been engaged in the design and manufacturing of electronic control devices. In manufacturing, we actively utilize overseas electronic components from a cost-reduction perspective, enhancing our price competitiveness. For over 17 years, we have participated in overseas exhibitions, importing only high-quality products. We are particularly skilled in sourcing electronic components from Taiwanese manufacturers. We can directly import a wide range of overseas electronic components, including compatible products from domestic manufacturers, so please feel free to contact us.

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