Decontamination of PFC, SF6, and NF3 at low temperatures below 600°C and with a decomposition rate of over 99%.
The PFC・PFN destruction device "Clean S PF・PFN" treats PFC, SF6, and NF3 at low temperatures (below 600°C) with a high decomposition rate (over 99%). Since the fluorine is fixed as a compound, no further treatment of the fluorine is necessary in subsequent stages. It features an easy-to-handle destruction column (reactor) exchange method, and the utilities required for destruction are only electricity, air, and nitrogen.
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● Endpoint detection system that confirms the endpoint (breakthrough) of the reactor using a gas detector. ● The closed cold state of the exhaust cylinder and line is detected by the pressure rise of the pressure sensor, automatically opening the bypass valve to bypass the exhaust cylinder. ● Single cylinder type: Replaceable without external leakage of harmful gases by air or nitrogen purge* (Note: Only PFN uses nitrogen purge). ● Double cylinder type: The gas detector detects the endpoint (breakthrough) of the reactor and can automatically switch to the standby cylinder. In addition to the functions of the single cylinder type, it allows for the replacement of the exhaust cylinder without stopping the etching device. ● By connecting a damper provided at the top of the device to the customer's exhaust duct for exhaust, the inside of the exhaust device becomes negative pressure, preventing any leaks from occurring inside the device from leaking outside the exhaust device in the event of a leak. ★ For more details, please contact us or download the catalog.
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