This is a wafer chemical cleaning device of the manual type for 3D implementation!
The processing capacity is suitable for small quantities of 1-3 sheets, making it ideal for research and experimental purposes. There are no installation constraints with a 100V power supply. Its compact size allows for installation in just 1 square meter, making it economical. The pure water rinse uses a cascade system to minimize pure water consumption, resulting in low costs. The chemical temperature can be controlled. The rinse effect is assessed using a resistivity meter. The wafer cassette is designed with an incline to prevent liquid residue on the wafer surface. Space has been secured for the future addition of a second tank (including the lower tank). It comes with an air gun. The chemical tank can be easily cleaned with a shower nozzle.
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basic information
- Device dimensions: W1300×D1150×H2110 - Power supply: AC100V 30A - Chemical tank: Compatible with two types of chemicals - Tank capacity is 9ℓ with a lower tank and circulation system - Pure water rinse: Cascade method - Two-stage rinse with a resistivity meter equipped in the final tank - Chemical tank: Temperature control device with liquid level sensor - Liquid receiving sink: Equipped with air gun - Shower nozzle for chemical tank inside the device
Price information
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Price range
P6
Delivery Time
※Three months after the order is received.
Applications/Examples of results
Manual cleaning device for 8-inch wafers for 3D implementation.
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Company information
July 2009: Received certification for a research and development plan related to the advancement of manufacturing infrastructure technology for small and medium-sized enterprises from the Ministry of Economy, Trade and Industry. June 2010: Began joint development with the National Institute of Advanced Industrial Science and Technology on glass etching for solar cells. February 2011: Ordered and received an 8-inch chemical cleaning system for the 3D semiconductor research center. July 2011: Contracted by Saitama Prefecture for the next-generation industry entry support project. November 2011: Developed an alkaline spin etching system. Specifications: For large substrates (300 mm square). February 2012: Completion of the next-generation industry entry support project in Saitama Prefecture. April 2012: Newly developed silicon wafer separator for solar cells.