We have reduced the solder balls to the absolute minimum!!
Lead-free solder paste FLF01-BZ is developed based on the concept of achieving an excellent total balance, particularly aiming to bring the occurrence of solder balls as close to zero as possible. It demonstrates good wetting properties even on difficult substrates such as nickel, and provides a smooth texture similar to whipped cream, allowing for easy release from the squeegee and achieving good printability. For more details, please contact us or refer to the catalog.
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basic information
【Features】 ○ Suppressed dross and minimized the generation of solder balls to the extreme. ○ Wetting properties → Good wetting even on difficult substrates like nickel. ○ Printability → Achieves excellent printability with a smooth feel, making it easy to release from the squeegee. ○ Flux residue cracking → The color of the residue is transparent, and there is almost no cracking of the residue. ○ Print release properties → No print smudging, bleeding, or backflow, and good release properties for micro lands. ○ Flux heat resistance → High heat resistance and long wetting duration make it ideal for solving issues like BGA non-fusion. ○ Flux residue tearing → Flux residue is difficult to tear from the solder surface, compatible with checker pin tests. ● For more details, please contact us or refer to the catalog.
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Company information
Under the brand Fine Solder, Matsuo Solder has a history of over 50 years. If you have any questions about solder, please feel free to consult us. We produce various alloys in forms such as rods, wires, and powders, and we develop appropriate fluxes to solve our customers' work-related issues. Since everything is produced in-house, we can customize to meet our customers' needs. We are also confident in our pricing.