The SQ series is an aluminum extruded type with a slit fin type.
We are pursuing high performance for heat sinks and radiators. The semiconductor devices (such as transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air circulation or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat processing with heat sinks. The SQ series heat sinks for surface-mounted devices are made of extruded aluminum and feature a slit fin design. *Online meetings are also possible, so please feel free to contact us.
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【Features】 〇 Pursuit of high performance for heat sinks and radiators 〇 Radiator for electronic components that prevents element destruction → Quickly transfers heat for cooling 〇 Composed of a base plate for mounting heat-generating elements and fins for dissipating heat from the base plate 〇 For surface mount devices 〇 SQ Series → Aluminum extrusion type → Slit fin type → Heat sink ● For more details, please contact us or refer to the catalog.
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One of the problems currently facing the electronics field is the issue of heat. Much of communication and information processing relies on computers, and there is a trend towards larger data volumes and larger systems. The computational power of CPUs, which are the heart of computers, demands even faster speeds, and the faster the processing, the more heat the CPU itself generates. The most effective way to manage this heat currently is through heat sinks. LSI Cooler, which has always considered heat management, has developed various heat sinks that efficiently dissipate heat, including a new type of heat sink called "Comb Fit." Utilizing precise heat measurement, development capabilities backed by thermal theory, and aluminum processing technology that enables the mass production of precise heat sinks, we develop and manufacture a variety of heat sinks ranging from those for computers to large ones for automotive equipment.
![[Technical Column #15] The Size of Heat Sink Surface Area and Its Heat Dissipation Effect](https://image.mono.ipros.com/public/product/image/553/2000999138/IPROS93367722604907278769.png?w=280&h=280)
