The YK/YU/YX series is a high-performance forced air cooling type with a comb fit design.
We are pursuing high performance for heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. 【Features】 〇 Radiators for electronic components that prevent device destruction → Quickly transfers heat for cooling 〇 Composed of a base plate for mounting heat-generating devices and fins for dissipating heat from the base plate 〇 High-performance forced air cooling 〇 Comb-fit type 〇 YK series → Fin-joint type single-sided base 〇 YU series → Fin-joint type single-sided base (narrow pitch) 〇 YX series → Fin-stacked type hollow double-sided base *Online meetings are also possible, so please feel free to contact us.
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basic information
A heat sink is an electronic component radiator that prevents the destruction of devices by quickly transferring and cooling heat. It typically consists of a base plate that attaches to the heat-generating element and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air circulation or using cooling media such as water. In LSI coolers, high-efficiency heat processing is achieved through heat sinks, continuously pursuing high performance supported by thermal theory. ● For more details, please contact us or refer to the catalog.
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One of the problems currently facing the electronics field is the issue of heat. Much of communication and information processing relies on computers, and there is a trend towards larger data volumes and larger systems. The computational power of CPUs, which are the heart of computers, demands even faster speeds, and the faster the processing, the more heat the CPU itself generates. The most effective way to manage this heat currently is through heat sinks. LSI Cooler, which has always considered heat management, has developed various heat sinks that efficiently dissipate heat, including a new type of heat sink called "Comb Fit." Utilizing precise heat measurement, development capabilities backed by thermal theory, and aluminum processing technology that enables the mass production of precise heat sinks, we develop and manufacture a variety of heat sinks ranging from those for computers to large ones for automotive equipment.
![[Processed Parts Results] Heat Sink](https://image.mono.ipros.com/public/product/image/7ad/2001211485/IPROS9380522357606938211.jpg?w=280&h=280)
![[Prototype Case of Sand Casting] HEAT SINK (Prototype)](https://image.mono.ipros.com/public/product/image/1a8/2000704541/IPROS70839758127525549033.png?w=280&h=280)
![[Processing Example] Copper Heat Sink](https://image.mono.ipros.com/public/product/image/734/2000804956/IPROS70123573239362460057.png?w=280&h=280)
