A system for upgrades that enables higher precision semiconductor testing.
OUM (Oven Upgrade Module)
Existing equipment can be used as is! Temperature adjustment for each chip is possible with burn-in testing.
The burn-in test, essential for quality inspection of semiconductor components. With the "iSocket," which allows for individual temperature adjustments that were not possible with conventional burn-in equipment, high-precision quality maintenance is achievable. The "Upgrade Module" from Wells CTI enables you to use this "iSocket" with your existing burn-in equipment (oven). It compactly integrates the power supply for heaters, fans, and controllers, as well as the data communication system. You can continue using your existing oven, significantly reducing the implementation costs. <Features> ■ Allows for individual temperature adjustments, enabling high-precision inspections ■ Minimizes infrastructure development ■ Lower cost compared to introducing new equipment ■ Supports up to 16 power supply and data communication connections per module
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basic information
All the infrastructure necessary for the installation of the "iSocket" is in place: - 48V heater power supply - 12V driver fan power supply - 5V controller power supply - I2C communication bus - Means for supplying the above power and data communication to all BIBs inside the oven Features: - Power supply and data communication to a maximum of 16 burn-in boards per module - Software executes power on/off control and monitoring for each slot - Easy USB connection to a PC equipped with iSocket Host software
Price information
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Price range
P5
Delivery Time
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Applications/Examples of results
A simple modification of the existing burn-in system will enable individual temperature management using isocket technology.
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SensorTa Technologies Japan, Inc., QINEX Division, joined the North American Boyd Corp group in August 2022 and became Boyd Technologies Japan LLC.