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  5. Printed Circuit Board
  6. Printed Circuit Board Manufacturing 'Special Boards'

Printed Circuit Board Manufacturing 'Special Boards'

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last updated:Jan 17, 2024

ケイツー
ケイツー
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We will introduce cutting-edge equipment and accommodate a wide range of special substrates such as IVH substrates, impedance substrates, resin embedding, rigid-flex, and metal substrates!

In recent years, printed circuit boards have become more precise, and there has been an increase in specifications that cannot be handled by traditional through-hole manufacturing methods. At K2 Corporation, we have taken on various types of circuit boards based on our past experience and achievements, and we have succeeded in development. By introducing cutting-edge equipment such as Direct Imaging (DI), we are able to accommodate a wide range of special circuit boards. Our staff's extensive knowledge and know-how regarding special circuit boards allow us to provide our customers with accurate technical advice. Additionally, we conduct impedance control measurements in-house, which are often outsourced to external vendors. For more details, please contact us or download our catalog.

    Printed Circuit Board
k2_tokusyukiban.jpg

Printed Circuit Board Manufacturing 'Special Boards'

k2_tokusyukiban.jpg
k2_tokusyukiban.jpg
  • Related Link - http://www.k2p.jp/product/special/index.html#ivh

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**Features** - By introducing cutting-edge equipment DI (Direct Imaging), we can accommodate a wide range of special substrates. ~Special Substrates~ - IVH Substrate → Can be manufactured using either blind via holes that connect the outer and inner layers or inner vias that embed through holes in the inner layer. - Impedance Control Substrate → Based on extensive past experience, we control pattern width and interlayer thickness to perform impedance control. - Through Resin-Filled Substrate (PAD on HOLE) → Resin and metal paste are embedded through vacuum printing. - Base Metal Substrate → By using materials like aluminum or copper, which have good thermal conductivity, heat generated from LEDs can be dissipated. - Build-Up Substrate → A method of creating multilayers by forming insulating layers on an insulating substrate one layer at a time to create conductor patterns and interlayer connections. - Fine Pattern → The introduction of cutting-edge DI equipment enables the generation of fine patterns that were not achievable with conventional methods. - For more details, please contact us or download the catalog.

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Have you ever been turned down because of a special substrate?

Have you ever been turned down because of a special substrate?

TECHNICAL
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Have you ever struggled with short deadlines?

Have you ever struggled with short deadlines?

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Are you paying unnecessary initial costs?

Are you paying unnecessary initial costs?

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Are you struggling with medium lot manufacturing (500 to 2,000 pieces)?

Are you struggling with medium lot manufacturing (500 to 2,000 pieces)?

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Have you ever been betrayed by quality?

Have you ever been betrayed by quality?

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Are you having trouble with component mounting?

Are you having trouble with component mounting?

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Company information

ケイツー

ケイツー

Electronic Components and Semiconductors

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In recent years, printed circuit boards have become increasingly precise and diverse. The demands from our customers for prototype manufacturers of printed circuit boards continue to rise daily, making flexible responses essential. K2 Corporation has been able to meet these demands by producing a wide variety of substrates in a short lead time through in-house integrated production. "Good products faster and more reliably" is our company policy, which may seem obvious, but we believe it encapsulates our customers' requests. All of our employees strive daily to achieve this fundamental goal, engaging in trial and error.

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