Stacking Positioning Device (OCR Type)
In the assembly of smartphone and tablet PC panels, the bonded panels are captured by a CCD camera for correction. After positioning, temporary fixation is performed using spot UV. This method is also applicable for high-precision bonding of 3D panels and similar products.
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basic information
The alignment marks of the bonded panels are captured by a CCD camera, and X-Y-θ corrections are performed. Gap adjustment is done while managing the load with a load cell, ensuring precision in the Z-axis direction.
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Applications/Examples of results
A device that performs temporary fixation using UV after positioning the adhered panel.
Company information
Shinko Engineering Co., Ltd. has continuously created unique products in the design and manufacturing field of information and communication technology-related devices and systems since its establishment. In particular, we have consistently demonstrated originality in motor drive technology for mechatronic equipment and conveyor systems, image processing technology for inspection and measurement devices, and application products of laser technology, as well as integrating these standalone devices into CIM as FA systems. Our mission is to fully utilize the technological capabilities we have accumulated so far and to deliver products and devices that will delight our customers more than ever before. In the future, we aim to be a one-of-a-kind company that consistently demonstrates originality in the ever-advancing field of information and communication technology.
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