We actively perform wire saw processing on various materials. We also accommodate short delivery times for mass production and small lot prototype processing.
Our company undertakes slicing processing (cutting processing) for various materials, including silicon wafers for solar cells. Utilizing various equipment, including multi-wire saws, we actively respond to customer needs for "processing expensive materials efficiently with minimal kerf loss," ranging from continuous production for mass production to lot production and individual production for research and development. If you are struggling with the costs or yield of cutting processing in your manufacturing or development operations, please feel free to consult Osaka Fuji Industry.
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Our company, leveraging our extensive processing experience with silicon for solar cells, also conducts cutting processes (slicing) for materials other than silicon, including magnetic materials, glass-based materials, sintered products, ceramics, various special alloys, and resin-based materials. In our slicing process using wire saws (multi-wire saws), we achieve high precision and low kerf loss (minimal cutting allowance and grinding allowance), enabling the processing of thin wafers (thin plates) from the millimeter range down to the micrometer range. We actively engage in small-lot rapid prototyping and short-lead-time mass production transactions across a diverse range of industries, including electronics, semiconductors, chemicals, and glass. Additionally, we are pursuing the possibilities of "cutting processing" by consolidating the full capabilities of the Osaka Fuji Industrial Group, which possesses various cutting equipment such as wire saws compatible with fixed abrasive and free abrasive methods, inner blade slicers, band saws, and water jet cutting machines.
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Details of Slice Processing Using Multi-Wire Saw 【Characteristics of Slicing】 High-efficiency slicing improves material yield and allows for the processing of large amounts of material in a single slice. Additionally, due to cold processing, it is less affected by heat generated during machining. 【Examples of Workpieces】 Compatible with silicon, quartz, sintered products, ceramics, carbide, and ultra-hard-to-machine metal materials. 【Dimensions and Shapes of Workpieces】 Width (up to 160mm) × Height (up to 160mm) × Length (up to 450mm) approximately *Please consult separately as this may vary depending on the equipment. 【Weight of Workpieces】 Approximately up to 20kg 【Product Shape】 Plate-shaped (linear cutting processing in one direction) 【Product Accuracy】 Thickness: 120μm or more, Surface roughness: Ra=0.5μm approximately (based on silicon slicing results) *Details will be discussed separately. 【Fixed Abrasive Method】 A method where wires with diamond abrasives attached through chemical means (nickel plating or resin bond) are run at high speed, while coolant (cutting fluid) is applied, pressing the workpiece against the wire to perform the cutting.
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Osaka Fuji Industrial Co., Ltd. has refined its welding, thermal spraying, and machining technologies, and has grown as a partner to major steel manufacturers since its establishment in 1955.