High thermal conductivity alumina (Al2O3) substrate, AlN substrate
● Alumina (Al2O3) substrate Thickness: 0.38mm and above Metallization: MoMn, W, Ni, Ag, Au ● AlN substrate Thermal conductivity 170W/m·k and above Thickness: 0.38mm and above Metallization: Cu, Ti/W, Pt, Ag, Au We will challenge at a low cost.
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basic information
Alumina (Al2O3) and AlN, which have high thermal conductivity, are important materials as circuit substrates. Various high-power electronic substrates are created from these ceramics through a metallization process. ● Alumina Substrate Al2O3 Substrate Thickness: 0.38mm and above Metallization: MoMn, W, Ni, Ag, Au ● AlN Substrate Thickness: 0.38mm and above Metallization: Cu, Ti/W, Pt, Ag, Au ● For more details, please contact us.
Price information
We will challenge at a low cost. We will provide a quote based on the drawings you provided.
Price range
P1
Delivery Time
※Please contact us.
Applications/Examples of results
●Semiconductor circuit ●LED chip ●Optical communication industry ●Medical-related
Detailed information
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Ceramic substrate High thermal conductivity ceramic substrate and metallization processing
Company information
We are a trading company specializing in material supply and contract processing of parts. We provide materials and products such as ceramics, quartz glass, engineering plastics, pure metals, and alloys to major semiconductor, industrial, and electrical industry companies in Japan. We support our customers' businesses with a three-pronged approach of technical expertise, cost, and quality, from meeting quality and price requirements to material selection proposals!
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