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  3. Manufacturing and processing machinery
  4. Mounting Machine
  5. Circuit board processing machine
  6. Femtosecond laser processing machine LaserStation(TM)

Femtosecond laser processing machine LaserStation(TM)

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LaserStation(TM)

last updated:Nov 22, 2012

オリオンテック
オリオンテック
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Introduced a processing machine equipped with IFRIT (Ifrit) from Cyber Laser Co. It enables high-precision micro-machining of difficult-to-process materials and achieves reduced friction.

Femtosecond lasers are cutting-edge technology that enables precise processing without the involvement of heat through a multiphoton absorption process. We provide high-stability, high-quality femtosecond lasers, including the IFRIT from Cyber Laser, which can be introduced not only for research purposes but also into actual production environments. We can repeatedly create V-grooves with high reproducibility. Additionally, we can process not only semiconductor substrates but also LSI chips, RFIDs, sapphire substrates for LEDs, and glass substrates for FPDs. We will perform precision processing of prototype parts and samples faster than anyone else! If you are facing issues with delivery times or accuracy, please feel free to consult us. For more details, please download the catalog or contact us.

    Other processing machinesCircuit board processing machineProcessing Contract
oriontec_laser.JPG

Femtosecond laser processing machine LaserStation(TM)

oriontec_laser.JPG
oriontec_laser.JPG
  • Related Link - http://www.oriontec.co.jp/

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【Examples of Processing with Femtosecond Lasers】 ○ Processing of Optical Devices Induced by Refractive Index Changes → Enables 3D integration of optical waveguides, branching paths, and diffraction gratings, as well as refractive index trimming of planar optical circuits. ○ Ultra-Fine Processing of Metal Materials → Achieves high-precision micro-processing by leveraging ultra-short time characteristics to minimize thermal effects to the extreme. ○ Friction Reduction with Nano-Periodic Structures → Nano-periodic structures with sub-micron periods can be created in various materials including metals, semiconductors, and dielectrics. ○ Inverted Taper Processing → Improves gasoline combustion efficiency and enables higher precision printing. ○ V-Groove Processing for Optical Diverter Installation → Can be created in a dry process and under atmospheric conditions without selecting materials, applicable to semiconductor substrates and glass substrates. ○ Scribing and Dicing Processing of Semiconductor Substrates → Utilizes non-thermal processing to minimize debris and molten layer generation, and reduces unnecessary damage to the substrate to the extreme. ● For more details, please download the catalog or contact us.

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【Applications】 ○ Information and communication materials ○ Automotive, aerospace, and space fields ○ Semiconductor devices and display fields For more details, please contact us.

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オリオンテック

オリオンテック

Manufacturing and processing contract

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1. Non-thermal ultra-fine processing of glass and ceramics using femtosecond lasers is possible. 2. We are fully equipped with in-house 5-axis machining centers, lathes, polishing, and wire processing, enabling complex machining. 3. Prototyping of prisms and light guide plates, as well as mold manufacturing. 4. Short delivery times are possible (if materials are in stock, immediate processing and same-day delivery can be arranged). 5. Processing is possible regardless of material (broadly accommodating materials from resin to hardened steel, titanium, and difficult-to-machine materials like nickel). 6. By providing consistent support from design and assembly to secondary processing such as plating and heat treatment, we are pleased to allow designers and engineers to freely design without worrying about the processing steps.

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