This is a circuit board with resin embedded in the through holes and pads placed on top.
This is a circuit board designed to secure the mounting space for components by embedding resin in through-holes and providing pads on top. With the trend towards narrower pitches for components such as BGA and CSP, the demand has increased. Resin and metal paste are embedded using vacuum printing. For more details, please contact us or refer to the catalog.
Inquire About This Product
basic information
【Features】 ○ Secures space for component mounting ○ A substrate with resin embedded in through holes and pads placed on top ○ Increasing demand due to the miniaturization of components such as BGA and CSP ○ Resin and metal paste embedded through vacuum printing ○ Successfully developed various substrates based on past experience and achievements ● For more details, please contact us or refer to the catalog.
Price information
Please contact us.
Delivery Time
※Please contact us.
Applications/Examples of results
For more details, please contact us or refer to the catalog.
catalog（7）
Download All Catalogs
Company information
In recent years, printed circuit boards have become increasingly precise and diverse. The demands from our customers for prototype manufacturers of printed circuit boards continue to rise daily, making flexible responses essential. K2 Corporation has been able to meet these demands by producing a wide variety of substrates in a short lead time through in-house integrated production. "Good products faster and more reliably" is our company policy, which may seem obvious, but we believe it encapsulates our customers' requests. All of our employees strive daily to achieve this fundamental goal, engaging in trial and error.