Compact with built-in CPU and audio processing circuit. Equipped with large-capacity flash memory.
The shape of the Bluetooth module is a SiP module, small embedded board, etc. The function is BT2.1 + EDR. Due to its compact size, it is ideal for wireless audio, sensor networks, and smartphone-linked applications. For more details, please feel free to contact us.
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basic information
【Specifications】 ○Wireless Interface →V2.1+EDR ○Antenna →External ○Wireless Transmission Power →Class2 4dBm ○Receiving Sensitivity →-88dBm@0.1%BER ○Interface →USB2.0, UART(3Mbps), PCM, Speaker, Microphone ○Flash Memory →16Mbits ○Supported Profiles →All profiles (however, the types that can be implemented depend on the capacity of the Flash memory) ○Operating Temperature (°C) →-20 to 70 ○Storage Temperature (°C) →-40 to +85 ○External Dimensions (mm) →13×11×1.9 →64-pin SMD type ○Radio Certification →Obtained by User equipment ●For more details, please feel free to contact us.
Price information
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Applications/Examples of results
【Applications】 ○ Wireless Audio ○ Sensor Networks ○ Smartphone-linked Applications For more details, please contact us.
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Our company's TCP/IP built-in WLAN solution has top performance among products in the same class. Additionally, we are focusing on the development of measuring instruments for mass production shipping tests of wireless devices, leveraging our technology in wireless device development.