We will introduce the key points of thin plate processing in high-precision machined parts.
We will introduce key points for reducing labor and improving quality in high-precision microfabrication, from the design and manufacturing of micro-machined parts. Topics include "Key points for thin plate processing in high-precision machined parts," "Key points for boss processing in high-precision micro parts," "Key points for tool changes in high-precision microfabrication," "Key points for thin plate processing in high-precision microfabrication," "Key points for improving processing quality in precision microfabrication," and "Key points for quality improvement design in precision microfabrication." For more details, please contact us or refer to our catalog.
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【Publication Content】 ○ Key points for thin plate processing in high-precision machined parts ○ Key points for boss processing in high-precision micro parts ○ Key points for tool changes to perform high-precision micro machining ○ Key points for thin plate processing in high-precision micro machining ○ Key points for improving processing quality in precision micro machining ○ Key points for quality improvement design in precision micro machining ● For more details, please contact us or refer to the catalog.
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Company information
Since its founding in 1970, Goto Seiki has cultivated cutting processing technology, particularly in the field of optical and measuring instruments, where high precision and shape requirements are demanded. This has become the foundational technology for our precision parts manufacturing. In the realm of development and prototyping that supports the forefront of manufacturing, this advanced cutting technology is indispensable. Additionally, we continue to evolve as a versatile group aiming for optimization in precision parts processing using non-ferrous metals and resins, as well as in micro-machining and mold technology.
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