Low dielectric constant, low dielectric loss tangent coverlay, bonding sheet. It is a material suitable for high-frequency design.
The low dielectric coverlay bonding sheet is a material compatible with low dielectric constant, low dielectric loss tangent coverlay, and high-frequency design. Due to its low Dk and Df, it contributes to reducing dielectric loss in transmission lines, and its low Dk allows for wider circuit conductors, enhancing the flexibility of wiring design. It can be press-formed at 160°C, eliminating the need for changes in auxiliary materials due to high-temperature pressing (above 160°C). It can be molded using the current coverlay press equipment. For more details, please contact us or refer to the catalog. We have developed an ultra-low dielectric and ultra-dielectric loss tangent adhesive sheet. For more details, please contact us.
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【Features】 ○ Materials compatible with high-frequency design ○ Low dielectric constant, low dielectric loss tangent ○ Contributes to reducing dielectric loss in transmission lines due to Low Dk and Df ○ Improved design flexibility for wiring, such as widening circuit conductors, due to Low Dk ○ Can be press-formed at 160°C, eliminating the need for changes in auxiliary materials due to high-temperature pressing (above 160°C) ○ Can be molded with existing coverlay press equipment ○ Usable for projects requiring UL registration for flame retardancy ● For more details, please contact us or refer to the catalog. 〇 We have developed adhesive sheets with ultra-low dielectric constant and ultra-low dielectric loss tangent. For more information, please contact us.
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I want to develop technologies that shine brightly, even if they are small. Since its founding, Nikkankogyo has cultivated core technologies in "coating," "laminating," and "stacking." Our fundamental stance is to respond to the technologies that our customers seek. We always focus on our customers' future needs and create products with new ideas and unique technological development capabilities. This USER-ORIENTED spirit permeates all of our business processes. As product needs change rapidly and development cycles shorten year by year, we possess the insight to anticipate the future and dedicate ourselves to the technological development that brings those ideas to life.