ET-WEST 2013 Conference Materials: Design and Measurement for High-Speed Signals
ET-WEST2013 (Embedded Comprehensive Technology Exhibition) Conference Materials [Design and Measurement for High-Speed Signals - Utilizing Actual Measurements and Simulations] In high-speed signals such as USB 3.0 and PCI Express, the effects of attenuation and reflection in circuit board patterns become significant, leading to what is known as signal integrity issues. Understanding signal integrity issues is effectively supported by circuit board simulations. Additionally, actual circuits employ circuit technologies to compensate for such attenuation, and these circuit technologies must also be reflected in signal evaluations. This session will provide an overview of the current state related to design and measurement. Speaker: Yoshiki Tsuji Teledyne LeCroy Japan Co., Ltd. Department Manager, Technical Department
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Content - Treating printed circuit board traces as transmission lines - Evaluation of interconnects - Compensation for signal degradation due to interconnects - Signal evaluation using simulations - Crosstalk analysis - Debugging methods using simulations
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Company information
Teledyne LeCroy Japan, Inc. was established on September 14, 1990, as a wholly-owned subsidiary of Teledyne LeCroy Corporation (New York, USA). We have set up sales offices and support centers in Tokyo and Osaka to meet the needs of our customers in Japan. On November 16, 2001, we obtained ISO 9001:2000 certification. We aim to contribute to our customers' product development and problem-solving by providing technical documentation, analysis software, and technical seminars in Japanese free of charge.