Removal of BGA (CSP) without thermal load!!
- It is possible to remove the IC while minimizing the effects of heat. - It is a tabletop-sized milling machine. - Teaching is simply specifying the two diagonal points of the IC and the depth (in automatic creation mode). It can be easily created with dedicated software and a controller. Height is automatically adjusted, so teaching is not necessary. It is also easier to prevent excessive cutting. - Switching cutting patterns is also simple. Positioning and warping correction jigs are required for each circuit board.
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basic information
The BGA(CSP) cutting device is a machine that removes BGA (Ball Grid Array) and CSP (Chip Size/Scale Package) through cutting. It is particularly effective for removing BGA(CSP) with underfill.
Price range
P5
Delivery Time
Applications/Examples of results
You can remove ICs (BGA, CSP) that are mounted on small printed circuit boards, such as those found in smartphones and mobile devices.
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Company information
Omiya Industrial Co., Ltd. manufactures and sells precision measuring instruments, semiconductor and liquid crystal manufacturing-related equipment, and provides maintenance for rotating machinery. Please feel free to contact us if you have any inquiries.
