Rework for mobile devices!!
- It has a compact design that allows for installation on a tabletop. - Since it uses partial heating, it minimizes thermal load on surrounding components that should not be heated. - It can flexibly accommodate a variety of circuit boards. - It can handle complex temperature profiles.
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basic information
This is a device for soldering small BGA (CSP) components using a halogen heater and hot air.
Price range
P5
Delivery Time
Applications/Examples of results
It is possible to mount ICs (BGA, CSP) implemented on small printed circuit boards, represented by smartphones and mobile devices.
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Omiya Industrial Co., Ltd. manufactures and sells precision measuring instruments, semiconductor and liquid crystal manufacturing-related equipment, and provides maintenance for rotating machinery. Please feel free to contact us if you have any inquiries.