Optimal for wafer transport in semiconductor manufacturing equipment and inspection devices compatible with 300mm.
The GCR4000-PM series is a multi-axis type, 4-axis horizontal articulated clean robot suitable for wafer transport within semiconductor manufacturing equipment and inspection devices that accommodate 300mm. It is possible to choose between base type and flange type according to the equipment layout. It can be equipped with optimal chucks tailored to the transported items and equipment layout. For more details, please contact us or refer to the catalog.
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basic information
【Features】 ○ Arm variation: 210mm ○ Capable of handling 2 FOUPs with the robot alone ○ Z-axis variation: 300mm ○ Load capacity: 3kgf or less based on the third joint of the arm ○ Base type and flange type can be selected according to the equipment layout ○ Equipped with operation monitor ○ Control method: RS232C and parallel photo I/O ○ Uses 2-phase stepping motors with absolute encoders on all axes ○ High-speed and high-precision wafer transport through S-curve acceleration and deceleration control ○ Wafer holding: vacuum suction, drop-in, edge grip chuck ○ Chuck materials can be various, including CFRP, aluminum, ceramics, etc. ○ Can accommodate optimal chucks tailored to the transported items and equipment layout ● For more details, please contact us or refer to the catalog.
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