Intentionally added Ni and Ge to the low-silver type that emphasizes low cost! Connection reliability has significantly improved.
The "FLF30-AZ" suppresses the growth of intermetallic compound layers due to the intentional addition of Ni, resulting in improved connection reliability. Additionally, it has transitioned from a conventional Ag3% alloy to an Ag1% alloy, and the reduction in the amount of expensive Ag has been mitigated by the new development of flux, which has improved wetting performance. 【Features】 ○ Suppresses the growth of intermetallic compound layers through intentional addition of Ni ○ Improved connection reliability ○ Significant cost reduction by reducing the amount of expensive Ag ○ Improved wetting performance due to the new development of flux ● For more details, please download the catalog or contact us.
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【Features】 ○ Suppression of intermetallic compound layer growth by intentional addition of Ni ○ Improved connection reliability ○ Reduction of expensive Ag content, leading to significant cost reduction ○ Decrease in wetting has been improved by the new development of flux ● For more details, please download the catalog or contact us.
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Under the brand Fine Solder, Matsuo Solder has a history of over 50 years. If you have any questions about solder, please feel free to consult us. We produce various alloys in forms such as rods, wires, and powders, and we develop appropriate fluxes to solve our customers' work-related issues. Since everything is produced in-house, we can customize to meet our customers' needs. We are also confident in our pricing.