It is an inline equipment for tie bar cutting, solder plating, and cleaning.
The LED manufacturing equipment is an inline system for tie bar cutting, solder plating, and cleaning. It automates the press cutting of some parts of the middle and lower bars of vertical LED types, as well as the soldering and cleaning processes. The system employs a turntable method for controlling the amount of solder plating on the leads and a rotary cleaning method, making it a streamlined inline facility. For more details, please contact us or refer to the catalog.
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**Features** - LED manufacturing equipment - Inline equipment for tie bar cutting, solder plating, and cleaning - Partially press-cutting the middle and lower bars of vertical LED types, automating soldering and cleaning - Inline control from solder plating amount of leads to cleaning - Adopts turntable method and rotary cleaning method **Specifications** - Power supply: 3-phase, AC200V - Air: 0.4MP or more - Vacuum: none - External dimensions: (W) 5,840mm × (D) 1,600mm × (H) 1,800mm - Weight: approximately 3,600Kg - Cleaning: hot water supply, IPA supply - Target lead frame size: width 37mm to 52mm, length up to 174mm - Tact: 5.0 seconds per lead frame - No change kit included (tie bar cutting mold not included) For more details, please contact us or refer to the catalog.
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We specialize in the development, design, and manufacturing of various handlers, taping machines, image processing equipment, and inspection machines, focusing on semiconductor backend process-related equipment. We excel in custom-made solutions tailored to our customers' needs and can also accommodate equipment modifications and maintenance as required. Additionally, we have a high-class cleanroom and offer OEM production services for the assembly and inspection of various electronic components. Please feel free to contact us.