You can cut without damaging the work and without being limited by the material!
At Kanemoto Seiko Co., Ltd., we handle the processing of quartz, crystal, optical glass, ceramics, silicon, magnets, and single crystals. Our grinding and cutting with free abrasive grains allows for cutting without damaging the workpiece and is suitable for various materials. We can achieve processing accuracy of up to ±0.003 through lapping. For more details, please contact us or refer to our catalog.
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basic information
【Processing Size (Material Shape / Processing Dimensions / Processing Accuracy)】 [Cutting Processing] ○ Maximum Cutting Workpiece: 420×420×420 / Opening 420×3.0mm～ / ±0.1 or less ○ Large Cutting Workpiece: 300×300×300 / Opening 300×2.0mm～ / ±0.1 or less ○ Thinnest Cutting Dimension: - / 120×40×0.2mm / ±0.02 or less ○ Thinnest Cutting Dimension: - / 120×100×0.4mm / ±0.04 or less ○ Thinnest Cutting Dimension: - / 150×150×0.6mm / ±0.06 or less ○ Minimum Processing Dimension (Record): - / 0.15×0.25×1.20mm (including lap processing) / ±0.02 or less [Wire Saw] ○ Maximum Cutting Workpiece: 650×550×400 / 0.85mm～8mm / ±0.02 or less ○ Maximum Cutting Workpiece: 1000×1100×350 / 3mm～16mm / ±0.05 or less ● For more details, please contact us or refer to the catalog.
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Company information
Kanemoto Seiko Co., Ltd. has been cultivating technology as a specialized cutting processing company since its establishment, in order to meet the trust of our customers. Furthermore, to respond to the diversification of future needs, we have introduced large wire saw cutting machines and are working to enhance our system with the aim of becoming the only one in this field. While responding to the increasingly sophisticated demands of our customers, we will establish a production system that takes the environment into consideration and contribute to the local community.