The LithoglasTM glass sealing technology protects the drive components and important sensor parts of MEMS packages by sealing them with a glass cap.
For MEMS packages such as pressure sensors and laser scanners. It is possible to supply at the wafer level, allowing for post-processing after being attached to the wafer. Various circuits, shapes, and rims are formed integrally on a glass substrate. The chip surface is protected by glass and passivation film formation. 【Contents】 ○ Wafer-level capping ○ Preform molding ○ Glass and passivation film formation ◎ For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Contents】 ○ Wafer-level glass sealing ○ Hybrid silicon glass cap ○ Full glass cap ○ Hermetic bonding substrate (anode) ○ Package for microfluidics ○ Glass passivation film ◎ For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
○ It is possible to change from ceramic to plastic packaging to protect the chip surface with a glass coating. ○ Miniaturization of package size and cost reduction are possible. ○ Performance is significantly improved by using glass and inorganic materials. ○ The process is easy without using expensive materials. ○ A new package configuration is made possible. ● For more details, please contact us or download the catalog.
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