You can bond the dielectric directly to the copper plate without using adhesive.
Microwave laminate "Copper Clad" is an amorphous thermoplastic material made from polyetherimide, which maintains thermal stability while possessing isotropic electrical properties and mechanical characteristics. It can be bonded directly to copper plates as a dielectric without the use of adhesives. 【Features】 ○Thermally Stable ○Isotropic Properties ○High Temperature Performance For more details, please contact us or download the catalog. *This catalog is in English.
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【Specifications】 ○Dielectric Constant: 3.05 ○Dissipation Factor: 0.003 ○Dielectric Strength (0.062”): 830 V/mil ○Volume Resistivity: 6.7 × 10^17 ohm · cm ○Maximum Temperature: 225 °C ○Thermal Conductivity: 0.22 W/m/°C ○Specific Gravity: 1.27 ○Thermal Expansion: 56 ppm/°C (Unclad Dielectric): 56 ppm/°C 56 ppm/°C ○Water Absorption: 0.25 % ○Copper Peel (Average): 6-8 lbs/in ○Operating Temperature: -55 to 175 °C ○RoHS Compliant: Yes ●For more details, please contact us or download the catalog. *This catalog is in English.
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With the motto "Pleasant Transactions - Amicable Business -", we are actively working every day to provide high-performance overseas components at prices that our customers can appreciate. We engage in close communication with our overseas partners to not only supply products that meet your needs but also to provide comprehensive support, including technical aspects. We also offer a wide range of solutions for products from manufacturers that do not have agents in Japan and whose procurement methods may be unclear.