Handbook for Lead-Free Implementation Troubleshooting in Mass Production Sites
★Reduce defects! Practical lead-free implementation know-how that you can apply immediately. ★Thorough understanding with over 1,000 diagrams and photos!
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Publication Date: March 23, 2011 Price: 38,000 yen + tax Format: B5 size softcover, 215 pages (black and white, some color) ISBN: 978-4-904080-71-9 *For detailed content, please download the catalog.*
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P2
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Author Implementation Advisor: Kazuo Kawai From the Author *Excerpt from the Introduction* Currently, the mass production sites for surface mounting are facing a shortage of personnel, and the workers are constantly changing. Additionally, product development and design changes are carried out in a short period, so management is done through numerical values and standards. Once a standard is established, it rarely changes. This is particularly true in industrial equipment, where the standards and materials adopted in the early stages are often still in use. However, the fundamental substrates, components, and designs are constantly changing, necessitating a review of solder materials (flux) and mounting conditions that adapt to these changes. The evaluation of solder materials on-site is based on usability and chemical quality differences in flux. By controlling the flux, it has become possible to reduce the defect rate (in terms of component count) in mass production sites (including overseas factories) regarding reflow from the single-digit ppm to below 0.1 ppm. Furthermore, model switching is mostly managed by changing the conveyor speed, significantly improving production efficiency in some lines. This book is intended not so much as a technical manual but as a resource aimed at enhancing the initial analysis of mounted products and flexible countermeasures for defects based on the actual results produced on-site.
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