To the core of LED
★LED Devices - Comparison of crystal growth on both substrate and compound semiconductor sides - Fabrication of sub-wavelength structures on the device surface and their optical effects - Impact of polarization fields and avoidance strategies; latest etching and laser processing ★Phosphors - Synthesis methods considering improved luminous efficiency / Improvement of color unevenness due to phosphor thickness - Characteristics and challenges of various types such as YAG, BOS, and nitrides - Evaluation methods and required characteristics / Trends in white LEDs without phosphors ★Optical Design/Simulation - Calculation/analysis of internal quantum efficiency, light extraction efficiency, and light distribution characteristics - Temperature-dependent optical simulations / Limitations of simulations - Light distribution design / Optical control, lens shapes, and practical lighting fixture design ★Performance Improvement/Discussion - Enhancement of LED chip brightness and orientation - Improvement of light extraction efficiency and luminous efficiency through photonic crystals - Innovations for improving reliability and durability / Strategies to reduce electrostatic effects and distortions around the device - Evaluation of color reproduction and color rendering / Characteristics and issues of NIST standard measurements - Considerations on thermal characteristics, mass production, and costs
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basic information
Publication: End of November 2008 Price: 69,000 yen + tax Format: B5 size, 709 pages ISBN: 978-4-904080-09-2 *For detailed content, please download the catalog.*
Price range
P2
Delivery Time
P2
Applications/Examples of results
★Electrodes/Implementation/Sealing/Heat Dissipation/Driving - Surface protective film for electrodes against pickups - Package requirement characteristics and assembly technology / Maximum stress points of chip LEDs - Lead frame details, die, wire bonding - Characteristics/challenges of epoxy/silicone / Analysis of epoxy cracks - High-brightness package structure / Vacuum printing sealing - Functions required for heat dissipation materials and peripheral components - Specific numerical values such as thermal conductivity / Heat dissipation of ceramic substrates - Various driving methods such as pulse driving and dimming control ★Evaluation and Quality Assurance - Measurement methods for luminous characteristics and trends in standardization - Approaches to reliability testing and case studies of LED degradation analysis based on degradation mechanisms - Measures that should be taken by light-emitting device manufacturers and equipment manufacturers to ensure reliability ★Latest Products by Category - Current status and roadmap of lighting application developments - Manufacturing, implementation, usage examples, and challenges in sensor applications - Projectors / Printers / Large-scale displays / Agriculture / Visible light communication - Automotive headlamps / GaN-based high-output LD ★Market Trends and Patents - Current market size for each product and future outlook / Cost benefits and predicted declines - Overview of lawsuits, status of cross-licensing, and application status of overseas companies in Taiwan, South Korea, etc.
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The information organization aims to contribute to the development of the industry through technical seminars on chemistry, pharmaceuticals, electronics, machinery, environment, cosmetics, food, etc., as well as the publication of technical books, correspondence courses, and DVDs that record seminars.