It etches locally and with high precision within the substrate surface.
Scia Systems GmbH was established by key staff who developed the software and hard wafers for the ion beam trimming (trimming processing, IBF) device IonScan from Roth&Rau AG and MicroSystems GmbH. Scia Systems develops unique and proprietary cutting-edge ion beam and plasma technologies, handling equipment from research and development to mass production.
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●Features This device uses a focus ion beam manufactured by Ski Systems to perform localized and high-precision etching on the substrate surface. ●Applications We propose an ion beam trimming device that is optimal for improving film thickness distribution and yield on substrates such as SAW, BAW, TFH, and SOI. Please feel free to contact us for more details about this device.
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Scia Systems GmbH was established by key staff who developed the software and hard wafers for the IonScan device, an ion beam trimming (trimming processing, IBF) equipment from Roth&Rau AG and MicroSystems GmbH. Scia Systems develops unique and proprietary cutting-edge ion beam and plasma technologies, handling both research and development equipment as well as mass production equipment.
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Our company website features information on used equipment related to FPD and semiconductors. ● Main Business Activities Purchase of used semiconductor manufacturing equipment, refurbishment, sales, and setup operations Construction and consulting for semiconductor manufacturing lines Purchase of used FPD manufacturing equipment, refurbishment, sales, and setup operations Construction and consulting for FPD manufacturing lines Contract development, manufacturing, and sales of semiconductor manufacturing equipment and FPD manufacturing equipment Sales of various equipment parts Agency sales of overseas manufactured equipment