[Laser Microfabrication Examples] Multi-hole processing of polyimide, mesh processing of stainless steel examples.
Introducing two machining examples related to high-speed fine multi-hole processing! You can also view processing photos from the left. ■ Multi-hole processing on polyimide Holes with a diameter of 20 µm were processed into polyimide (125 µm thick). The processing time was less than 0.1 seconds per hole. There was no distortion or warping due to heat, and the film remained flat after processing. By applying on-the-fly technology, high-speed processing of thousands of holes per second is also possible. ■ Hole processing on stainless steel Many holes with a diameter of 20 µm were laser processed into 35 µm thick stainless steel SUS430. The shape of each hole is good, resulting in clean hole processing. Processing with a narrower pitch is also possible. For more details on various laser processing examples, please download and view "Case Studies on the Introduction of Laser Fine Processing Machines & Problem Solving Vol. 1" from the link below.
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Hikari Co., Ltd. is a joint venture with Germany's 3D-Micromac, a world-class manufacturer of laser microprocessing equipment, and acts as the general agent in Japan. The company has introduced picosecond laser microprocessing equipment manufactured by them, achieving high-quality processing for drilling, cutting, and marking on various materials using this cutting-edge laser microprocessing equipment. *For detailed information on equipment introduction and processing achievements, please download and view the brochure.*
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【Medical and Life Sciences Field】 Various types of marking, medical stent processing, thrombus filter processing, microchannel formation, ophthalmic treatment, injection needle processing, leak test holes, biochip mold processing, laser scalpel, protein crystallization, hollow micro-needles, etc. 【Solar Cell Field】 Through-hole processing, edge isolation, P1, P2, P3 scribing, marking, wafer dicing, organic material coating, drying furnace, texturing, device cutting, laser welding. 【Electrical and Electronic Field】 Through-hole processing, wafer cutting, insulation processing/trimming, marking, pinhole processing, electrode formation, metal mask processing, lens cutting, 3D printing, device cutting, texturing, internal glass marking. 【Precision Instruments Field】 Optical waveguide processing, fine mold processing, watch parts processing, microchannel formation, inkjet nozzle processing, resin parts cutting, surface roughness control, fine welding, gear processing, electrode processing, fine marking, fine nozzle processing. For more details on our introduction and processing achievements, please download our brochure or contact us directly.
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Company information
We are a joint venture with Germany's 3D-Micromac, a world-class manufacturer of laser microfabrication equipment, and we operate as the general agent in Japan. Microfabrication equipment using picosecond and femtosecond lasers is widely applied in the production of thin-film solar cells, organic EL for lighting, automotive parts, precision machine components, cutting and drilling of transparent materials with internal marking, and medical devices. Additionally, high-precision inkjet nozzle micro-drilling equipment using excimer lasers is also adopted by world-class inkjet manufacturers. We strive to meet our customers' advanced microfabrication requirements and contribute to the technological innovation of Japan's manufacturing industry.
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