Achieves both high adhesion and bending resistance! Ideal for electromagnetic wave shielding applications.
The high-flexibility silver paste "SW1600C" achieves excellent EMI shielding hardening by ensuring the specified film thickness. It balances high adhesion and bend resistance. Even in bending tests under low-temperature conditions, the maintenance of characteristics such as bend resistance can be measured. It is ideal for electromagnetic wave shielding applications. 【Features】 ○ Ensures the specified film thickness for high EMI shielding hardening ○ Balances high adhesion and bend resistance ○ Ideal for electromagnetic wave shielding applications For more details, please contact us or download the catalog.
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basic information
【General Characteristics】 ○Viscosity (at 25℃): 250 dPa·s [VT-04 type] ○Curing Conditions: 150℃×20min [Hot air circulation drying oven] ○Surface Resistance Value: 80 mΩ/□ [Film thickness 10μm] ○Change in Resistance Value after Bending: ≦15% [180° folding × 10 times] ●For more details, please contact us or download the catalog.
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Applications/Examples of results
【Usage】 ○ Electromagnetic wave shielding ● For more details, please contact us or download the catalog.
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Recent advancements in electronics have made remarkable progress, significantly transforming our lives to be more convenient and comfortable. Moving forward, electronics will continue to break through the conventional notion of "impossible" and will lead us into a new world of a highly information-oriented society, realizing dreams. To bring about this new world of electronics, it is essential to conduct research and development of outstanding electronic materials that support it. Our company will promote the development of even more advanced functional materials based on the experience and achievements we have built over many years in the research and development of electronic materials.