3rd generation Core i7-3517UE/i5-3610ME/i3-3217UE CPU equipped, 3.5" CPU board
Features ■ Equipped with 3rd generation Core i7-3517UE/i5-3610ME/i3-3217UE CPU ■ DDR3 1333/1600MHz 204-pin SO-DIMM x 1 (up to 8GB) ■ Supports VGA, LVDS, DVI-I ■ Operating temperature range -40 to 85℃
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basic information
Specifications ■CPU Equipped with 3rd generation Core i7-3517UE/i5-3610ME/i3-3217UE CPU ■Chipset HM76 ■Memory 1066/1333/1600MHz 204-pin SO-DIMM x 1 (maximum 8GB) ■VGA VGA, LVDS, DVI-I ■LAN 2x Gigabit LAN ■Expansion Slots 1 x mPCIe, 1 x mSATA ■Connectors 2 x SATA III, 2 x USB3.0, 8 x USB2.0, 1 x DIO 3x RS232, 1 x RS232/422/485, 1 x Line-out, Mic-in, Line-in ■Dimensions 146mm x 102mm ■Operating Temperature -40 to 85℃
Price information
Open price
Price range
P2
Delivery Time
P4
Applications/Examples of results
Factory and Building Automation / Multimedia Systems / Digital Signage
Line up（6）
| Model number | overview |
|---|---|
| OXY5336A-ET-3517UE | Core i7-3517UE, 1xDDR3 1333/1600 Max 8GB, Chipset HM76, 12V DC-in, -20～70℃ |
| OXY5336A-ET-3610ME | Core i5-3610ME, 1xDDR3 1333/1600 Max 8GB, Chipset HM76, 12V DC-in, -20～70℃ |
| OXY5336A-ET-3217UE | Core i3-3217UE, 1xDDR3 1333/1600 Max 8GB, Chipset HM76, 12V DC-in, -20～70℃ |
| OXY5336A-UT-3517UE | Core i7-3517UE, 1xDDR3 1333/1600 Max 8GB, Chipset HM76, 12V DC-in, -40～85℃ |
| OXY5336A-UT-3610ME | Core i5-3610ME, 1xDDR3 1333/1600 Max 8GB, Chipset HM76, 12V DC-in, -40～85℃ |
| OXY5336A-UT-3217UE | Core i3-3217UE, 1xDDR3 1333/1600 Max 8GB, Chipset HM76, 12V DC-in, -40～85℃ |
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Company information
Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.