Third generation Core i7/i3 CPU equipped, StackPC CPU board
Features ■ Equipped with 3rd generation Core i7/i3 CPU ■ 2 x DDR3 1333/1600MHz XR-DIMM with ECC (up to 8GB) ■ VGA + LVDS ■ Extended temperature range -20 to 70℃
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basic information
Specifications ■CPU Equipped with 3rd generation Core i7/i3 CPU ■Memory 1 x DDR3 1333/1600MHz XR-DIMM w/ECC (maximum 8GB) ■VGA VGA + LVDS ■NAND Flash Drive 1 x 8 GB SLC or 32 GB MLC ■LAN 2 x Gigabit LAN ■Connectors 2 x SATA III, 2 x RS232, 2 x RS422/485, 2 x USB2.0 ■Dimensions 96mm x 121mm ■Operating Temperature -20 to 70℃
Price information
Open price
Price range
P2
Delivery Time
P4
Applications/Examples of results
Factory and Building Automation / Multimedia Systems / Digital Signage
Line up（2）
| Model number | overview |
|---|---|
| OXY5535B-ET | 3rd Gen Core i7/i5/i3, 1xXR-DIMM DDR3 1600 Max 4GB, NAND Drive 32GB, -20～70℃ |
| OXY5535B-UT | 3rd Gen Core i7/i5/i3, 1xXR-DIMM DDR3 1600 Max 4GB, NAND Drive 32GB, -40～85℃ |
News about this product（2）
Company information
Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.