The shortest 24 hours! A four-layer board that leads your business to success.
Yuki Corporation responds to customer requests with the technical expertise cultivated over many years. To achieve goals such as stable quality, improved operational rates, and avoiding duplication of capital investment, experts from printed circuit board manufacturers and partial processing manufacturers have joined forces to establish a printed circuit board manufacturing company with an in-house integrated production system. We are committed to "manufacturing" and have built a production line that meets customer demands for small quantities, diverse varieties, and short delivery times. Furthermore, we will continue our unwavering efforts to deliver "valuable products," "services," and "peace of mind" as a company based on high quality and excellent technology. **Features** - Consistent support from design to printed circuit board manufacturing to component mounting. - Partial processing of surface treatment is also handled in-house. → Metal masks, various metal etching, electroplating, electroless gold, etc. - Ultra-short delivery times. Medium-volume products can also be delivered quickly. - Actively responding to high-layer, high-density, and high-difficulty products. → High-layer boards up to 20 layers, high-density boards with 5 pins between. - Actively working on environmental measures such as halogen-free materials and lead-free options. For more details, please contact us or download the catalog.
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basic information
【Specifications】 [4-Layer Board] ○ Material: Core R-1766 1.0T 35μ/35μ ○ Prepreg: R-1661 0.2T used ○ Outer layer copper foil: 18μ or 35μ ○ Board thickness: Finished 1.6T (±0.19) ○ Surface treatment: Heat-resistant preflux ○ Impedance: Not supported ○ SP24 ○ 6 layers can also be discussed ● For more details, please contact us or download the catalog.
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Company information
In the printed circuit board business of Yuki Corporation, we respond to ultra-short delivery times. In the electronics business, we also engage in software development and electronic device development. We handle everything from prototypes to mass production. We can provide a consistent response from printed circuit board design to board manufacturing and component assembly. We support metal masks, various metal etching, electroplating, electroless gold, and thick gold bonding, among others. "More than one" is our company's policy. We actively respond to high-layer, high-density, and high-difficulty products (high-layer up to 20 layers, high-density up to 5 pins between vias). We are also actively working on environmental measures such as halogen-free materials and lead-free RoHS compliance.