We support everything related to substrate manufacturing. We can handle the entire process or just a single step.
In the printed circuit board business of Yuki Corporation, we respond to ultra-short delivery times. In the electronics business, we also engage in software development and electronic device development. We handle everything from prototypes to mass production. We can provide a consistent response from printed circuit board design to board manufacturing to component assembly. We support metal masks, various metal etching, electroplating, electroless gold, and thick gold bonding, among others. "More than one" is our company policy. We actively respond to high-layer, high-density, and high-difficulty products (high-layer up to 20 layers, high-density up to 5 pins between vias). We are also actively working on environmental measures such as halogen-free materials and lead-free RoHS compliance. 【Business Content】 ○ Development, manufacturing, and sales of printed circuit boards and electronic devices For more details, please contact us or download the catalog.
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basic information
【Main Equipment】 ○ NC (Numerical Control) Drilling Machine → Drilling processing using machines with 1 to 6 axes of operation ○ Laser Processing Machine → Capable of drilling processing primarily on stainless steel plates using laser light ○ D.F. Auto Cut Laminator → Laminates dry film onto polished substrates ○ Alkaline Etchant → Uses tin as a resist for etching → Compatible with landless designs and more ○ Vacuum Lamination Press → After blackening treated core materials with patterning (inner layer), sets up prepreg and copper foil for lamination (heating and pressing) ○ AOI (Automated Optical Inspection Machine) → Detects disconnections, chips, pinholes, line thinning, thickening, and remaining copper by comparing with CAD data ● For more details, please contact us or download the catalog.
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Company information
In the printed circuit board business of Yuki Corporation, we respond to ultra-short delivery times. In the electronics business, we also engage in software development and electronic device development. We handle everything from prototypes to mass production. We can provide a consistent response from printed circuit board design to board manufacturing and component assembly. We support metal masks, various metal etching, electroplating, electroless gold, and thick gold bonding, among others. "More than one" is our company's policy. We actively respond to high-layer, high-density, and high-difficulty products (high-layer up to 20 layers, high-density up to 5 pins between vias). We are also actively working on environmental measures such as halogen-free materials and lead-free RoHS compliance.