Thin film dip coating device for photoresist solution on multiple substrates.
This device is a dip coater that automatically performs the DIP/drying process for the purpose of thin film dip coating of multiple 3.5-inch wafers, metal plates, glass, etc., simultaneously with photoresist liquid. It is a dip coater that applies the dip coating technology owned by SDI.
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basic information
【Main Specifications】 1. Stroke: 290mm 2. Target Size: 3.5 inch wafer 3. Target Materials: Wafer, metal, glass, etc. 4. Dip Speed: From 0.1mm/sec to 60mm/sec 5. Coating Liquid Circulation: Yes 6. Coating Liquid Temperature Control: No 7. Filter Mesh: Yes 8. Drying Section: Yes 9. Drying Temperature: 100℃ 10. HEPA Unit: Yes 11. Equipment Size (Approx.): W:1800×D:1100×H:1850mm
Price range
P7
Delivery Time
Applications/Examples of results
Simultaneous dip coating of a thin film of photoresist solution on multiple 3.5-inch wafers, metal plates, glass, etc.
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Company information
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