High-precision development wafers, ultra-high resistance, ultra-low resistance wafers available!
We handle high-precision development wafers, ultra-high resistance and ultra-low resistance wafers for university research institutes, and prime wafers for special applications. After forming patterns and electrodes on the surfaces of materials such as silicon, silicon carbide, ceramics, and compounds, we can process them to the specified thickness while minimizing distortion. Atok's unique advanced technology enables lap processing that reduces machining distortion. Product inspections include intermediate checks during the processing stages, meticulous inspections by skilled technicians, advanced inspections using three-dimensional measuring instruments, and final inspections conducted in a clean room with a fully controlled environment to ensure satisfactory quality, supported by the highest standards of quality management. For more details, please contact us or refer to our catalog.
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basic information
【Features】 ○ Capable of wrap processing with minimized deformation ○ Wrap processing possible on the back side while retaining surface patterning ○ Intermediate inspections during the processing stages ○ Thorough inspections by skilled technicians ○ Advanced inspections using laser micrometer measurement equipment ○ Precise inspections conducted in a clean room with a fully controlled environment ● For more details, please contact us or refer to the catalog.
Price information
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Applications/Examples of results
We will accommodate your requests regarding supply size, thickness dimensions, thickness accuracy, quantity, etc. For more details, please contact us or refer to the catalog.
Company information
We are a company that performs precision grinding of optical glass, semiconductor materials, and various materials, as well as welding and comprehensive processing of quartz glass, which are essential for the electronics and optical industries.