High-speed cutting of extremely difficult-to-process materials like "SiC and glass" is possible! A technology essential for the spread of EVs!
With the spread of EVs (electric vehicles) and the increase in power consumption due to network connections between electronic devices, there is a growing demand for semiconductors that can handle higher output and higher current. "Power semiconductors" using next-generation semiconductor materials such as SiC are gaining attention. However, the processing of hard and brittle SiC requires advanced technology. Traditional mechanical and laser cutting methods face many issues, such as slow processing speeds, chipping, a wide cutting width leading to reduced production volume, and the inability to cut electrode surfaces. Our laser micro-processing technology, "TLS-Dicing," utilizes thermal stress from temperature differences between heating and cooling, enabling high-speed cutting even for difficult-to-process materials like SiC and glass. It can be utilized in various industries that handle hard-to-cut semiconductor materials. *Actual processing photos and data for difficult-to-cut materials and hard brittle materials can be downloaded and viewed from the link below.
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basic information
The laser microprocessing "TLS-Dicing" can rapidly cleave difficult-to-cut brittle semiconductor materials due to thermal stress from temperature differences in heating and cooling. It is an environmentally friendly green technology. 【Advantages of Introduction】 - High-speed processing: Over 200mm/s - Non-contact processing: No tool wear - Zero cleaving width: Improved productivity - Crackless: Does not break even when bent - Complete cleaving: Can cleave back-side electrodes simultaneously - Batch cleaving: Can cleave laminated substrates at once - No thermal damage: Laser cutting typically causes thermal damage - Processing independent of lattice planes: Wafer resizing is also possible - Cost: Low maintenance costs *Actual processing photos and data for difficult-to-cut materials and hard brittle materials can be viewed by downloading the attached materials.
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Applications/Examples of results
【Examples of Corresponding Materials】 Sic, Si, GaAs, Ge, glass, etc. *For more details, please contact us directly.
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Company information
We are a joint venture with Germany's 3D-Micromac, a world-class manufacturer of laser microfabrication equipment, and we operate as the general agent in Japan. Microfabrication equipment using picosecond and femtosecond lasers is widely applied in the production of thin-film solar cells, organic EL for lighting, automotive parts, precision machine components, cutting and drilling of transparent materials with internal marking, and medical devices. Additionally, high-precision inkjet nozzle micro-drilling equipment using excimer lasers is also adopted by world-class inkjet manufacturers. We strive to meet our customers' advanced microfabrication requirements and contribute to the technological innovation of Japan's manufacturing industry.