Latest version of the release agent coating device (Nano Incoater)
This device is capable of simultaneously applying release agent and rinsing multiple glass nano-in-molds. It features a tank with a dual-chamber circulation mechanism, enabling automated control of various process patterns.
Inquire About This Product
basic information
【Main Specifications】 1. Stroke: 138mm 2. Target Size: W70×H70mm t1.5 3. Target Material: Glass, etc. 4. Dip Speed: From 0.1mm/sec to 30mm/sec 5. Coating Liquid Circulation: Yes 6. Coating Liquid Temperature Control: No 7. Filter Mesh: Yes 8. Drying Section: No 9. Drying Temperature: No 10. HEPA Unit: Yes 11. Device Size (Approximate): W:450×D:440×H:1000mm
Price range
P5
Delivery Time
Applications/Examples of results
This device is capable of simultaneously applying release agent and rinsing to multiple glass nano-in-molds. It features a tank with a dual-chamber circulation mechanism, enabling automatic operation and control of various process patterns.
Line up（1）
| Model number | overview |
|---|---|
| NIC-1106 | This device is designed to process 4-inch wafer substrates by applying a release agent, rinsing, and drying, thereby fixing the release agent onto the work surface. The processing is done one workpiece at a time. It is a dip coater-type device that reflects the dip coating technology owned by SDI. |
catalog（7）
Download All Catalogs
Company information
【Management Philosophy】 Be the number one company in customer satisfaction. 【Motto】 People can change in an instant! Everything starts now!