Design and assembly of production equipment [FA equipment, LCD and semiconductor manufacturing/testing equipment]
We offer design and assembly services for production equipment (inspection devices, manufacturing devices), capable of assembling everything from large equipment with a total weight of 50 tons to vacuum and wet systems!
■Assembly of Production Equipment (Manufacturing Equipment, Inspection Equipment) ●Features - Capable of assembling large equipment with a total weight of 50 tons. - Capable of assembling vacuum and wet systems. - Supports assembly precision in the micron range. 《Track Record of Production Equipment Assembly》 Semiconductor manufacturing equipment/inspection equipment/conveying robots LCD manufacturing equipment/inspection equipment/conveying robots Electrical panels/power boards FA equipment ●Clean Room (Assembly Environment) The floor is designed without columns to allow for flexible arrangements. Dimensions: Width 18m × Depth 32m × Ceiling Height 8.5m Entrance: Width 3.9m × Height 3.4m Cleanliness: Class 10,000 Load Capacity: 2 tons/square meter Pure Water: Maximum usage of 1000L/h Chiller: 0.49MPa, controlled at 5–30°C Forced Exhaust: 50 cubic meters/min, 400Pa N2 (Nitrogen Gas): 5 cubic meters/h (83L/min) Air (DRY): 0.83MPa, 1,225L/min ●Cranes (Assembly Equipment) Two cranes with a capacity of 4.8 tons + 4.8 tons (maximum 9.6 tons) and a height of 6.5m below the crane. With two cranes, it is possible to load parts with a maximum weight of 9.6 tons. This page provides basic information about equipment design.
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basic information
■Production Equipment Design (Manufacturing Equipment, Inspection Equipment) ●Features - Wide range of design including mechanisms, structures, and control systems - Design compliant with SEMI S2, S8, and CE marking standards - Design considering processing methods and equipment assembly (collaboration with processing and assembly departments) 《Production Equipment Design Achievements》 Semiconductor manufacturing equipment/inspection equipment LCD manufacturing equipment/inspection equipment Mechanical and control design for wafer and cassette transfer machines Loader/unloader equipment design Design for FOUP and SMIF compatibility Tooling design ●Design Technology 1. Mechanism Design and Proposal - Transport methods (robots, conveyors, etc.) - High-speed transport methods using precise positioning and clamping mechanisms 2. Structural Design - Enclosure design (sheet metal, steel frame, aluminum frame, interior and exterior) - Component and unit implementation design 3. Cleanliness Design (Assembly Environment: Clean Room Class 10,000, 1,000) - Cleanliness design within the equipment (airflow measures, local exhaust for sliding parts) 4. Vacuum Design (Low to Ultra High Vacuum) - Chamber and vacuum exhaust system design 5. Control Design - Wiring design for electrical equipment within the device - PLC control design - Control system design If you are considering the design and assembly of production equipment, please contact us.
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■ Areas of Expertise ◇ Control Panels ◇ Production Equipment (for production lines, FA devices/semiconductor manufacturing equipment/LCD manufacturing equipment, etc.) ◇ Analytical Instruments (control devices, medical devices, etc.) ◇ Financial Equipment (ATMs, stock control systems, etc.) ■ Assembly ◇ Unit assembly to equipment assembly of semiconductor/LCD manufacturing and inspection devices ◇ Assembly of transport robots for semiconductors/LCDs ◇ Assembly of various production and inspection devices ■ Design ◇ Mechanical design and control design of wafer/cassette transfer machines ◇ Design for FOUP and SMIF compatibility ◇ Design of various loader/unloader devices ◇ Design of various production and inspection devices ◇ Tooling design ■ Achievements ◇ Wafer/glass (LCD) handling UNIT equipment represented by semiconductor EEEM ◇ Various semiconductor/LCD inspection devices using customers' core technology (UNIT: theory) ◇ Electrical and power panel boxes and control racks installed in clean rooms ◇ Simple small shutter UNIT for operation inside vacuum chambers ◇ Resist stripping device using only pure water ◇ Ancillary devices for mask cleaning equipment ◇ SMIF POD opener device ◇ MEMS material testing machine (bending: deflection: creep: etc.)
Company information
We operate contract manufacturing (EMS/OEM/ODM) of communication equipment and various production devices with a motto of customer-first. ● Communication Equipment [EMS] Our production features cell production and multi-skilled worker production methods for diverse and variable production. We develop and manufacture products with consideration for environmental impact. ● Semiconductor Manufacturing Equipment [OEM/ODM] We handle everything from design to assembly and inspection of semiconductor manufacturing equipment. We have design technology compliant with SEMI S2, S8, and CE marking. ● Precision Machine Parts We can achieve precision cutting with an accuracy of 5 microns. (Aluminum, stainless steel, titanium, Inconel, engineering plastics) ● Commitment to Environment & Quality [EMS/OEM/ODM] As part of our QMS/EMS activities, we are working towards obtaining ISO9001 and ISO14001 certifications. We provide environmentally friendly, high-quality products. ● Factories [EMS/OEM/ODM] Domestic: Tono City in Iwate Prefecture, Kawasaki City in Kanagawa Prefecture, Inagi City in Tokyo, Miyaki District in Saga Prefecture Overseas: Jiangsu Province in China ● Other Achievements BMS, remote monitoring devices, embedded devices, TCP/IP protocol stack, IP core Next, we will introduce our achievements in EMS, OEM, and ODM products on this page.