Structural analysis of Adesto RM24EP128KS CBRAM
Adesto provides a technology that serves as an alternative to power-efficient, cost-effective flash memory, achieving long battery life for connected home devices such as home appliances, sensors, and monitors. CBRAM is seen as a promising successor to flash memory, offering cost and power savings. Adesto's CBRAM excels in energy efficiency, is CMOS compatible, and is designed for discrete and embedded memory applications. TechInsights' structural analysis report includes detailed layer-by-layer (LbL) analysis of the device structure, manufacturing processes, and compositions, as well as critical dimension measurements of general features, gate lengths and pitches, channel lengths, diffusion layer depths, well depths, field oxide thicknesses, and gate oxide thicknesses.
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basic information
Adesto provides a technology that serves as an alternative to power-efficient, cost-effective flash memory, achieving long battery life for connected home devices such as home appliances, sensors, and monitors. CBRAM is seen as a promising successor to flash memory, offering cost and power savings. Adesto's CBRAM excels in power efficiency, is CMOS compatible, and is manufactured for discrete and embedded memory applications. TechInsights' structural analysis report includes detailed layer-by-layer (LbL) analysis of device structure, manufacturing processes, and compositions, as well as critical dimension measurements of general characteristics, gate length and gate pitch, channel length, diffusion layer depth and well depth, field oxide thickness, and gate oxide thickness.
Price range
P5
Delivery Time
P2
Applications/Examples of results
Adesto provides a technology that serves as an alternative to power-efficient, cost-effective flash memory, achieving long battery life for connected home devices such as home appliances, sensors, and monitors. CBRAM is seen as a promising successor to flash memory, offering cost and power efficiency. Adesto's CBRAM excels in power efficiency, is CMOS compatible, and is manufactured for discrete and embedded memory applications. TechInsights' structural analysis report includes detailed LbL (layer-by-layer) method analysis of the device structure, manufacturing processes, and compositions, as well as critical dimension measurements of general features, gate lengths and gate pitches, channel lengths, diffusion layer depths and well depths, field oxide thicknesses, and gate oxide thicknesses.
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