Laser, ultimate thermal management for telecom devices. Cooler for ultra-small components.
TEC Microsystems (Germany) has developed a thermal management cooler for micro components. It is a three-layer miniature cooler unit designed for TO-39 headers. The temperature difference achieved between the top where the chip is mounted and the top of the header is 112 Kelvin (K), or 116 degrees Celsius. It demonstrates effectiveness in infrared sensors and avalanche photodiodes at 180-190 Kelvin.
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basic information
This is a three-layer miniature cooler unit developed for the TO39 header. The temperature difference between the top where the chip is mounted and the top of the header is achieved at 112 Kelvin (K), or 116 degrees Celsius. It demonstrates an effect of 180 to 190 Kelvin with infrared sensors and avalanche photodiodes.
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Ultimate Heat Management - Cooling for lasers and telecom devices - Cooling for infrared and X-ray detectors
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We will quickly provide all materials and products related to the packaging of semiconductors and electronic components.