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  5. Processing Contract
  6. Focused Ion Beam Processing Observation Device [Examples of Processing Available]

Focused Ion Beam Processing Observation Device [Examples of Processing Available]

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last updated:Oct 18, 2023

東レ・プレシジョン
東レ・プレシジョン
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Nano-order processing technology with a few microns or less! Low-damage processing (high precision and high quality) is possible with ultra-low acceleration voltage!

【PR Points】 - Ultra-fine hole processing of φ1um or smaller is possible - Fine structure processing is possible ...etc 【Principle of Focused Ion Beam (FIB) Processing】 By scanning a focused ion beam, concentrated to a few tens of nanometers, across the surface of a sample, secondary electrons generated can be detected, allowing for the observation of microscopic images and processing of the sample surface. The ion source of the FIB uses gallium ions, and when this ion beam is irradiated onto the surface of the sample, secondary electrons are generated from the sample surface. Additionally, since gallium ions are much heavier than electrons, a phenomenon known as sputtering occurs, where atoms constituting the sample are ejected. These ejected atoms become secondary ions and fly away from the sample. By utilizing these phenomena, observation and processing are performed. 【Specifications】 - Maximum work size: 50(X)×50(Y)×10(Z)mm - Minimum processing size (guideline): Groove width: 100nm (up to L/D=3), Hole diameter φ200nm (up to L/D=5) - High-speed and large-area processing with high probe current - Low-damage processing with ultra-low acceleration voltage (for TEM sample preparation, etc.) *Examples and achievements of processing are currently available. For more details, please contact us or download the catalog to view.

    Processing Contract
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Focused Ion Beam Processing Observation Device [Examples of Processing Available]

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  • Related Link - http://www.tpc-jp.co.jp/

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※Features - High probe current enables high-speed, large-area processing. - Secondary electron image resolution below 5nm. - Maskless processing allows selective etching of only the beam irradiation area. - Eliminates the mask fabrication process, leading to expected cost reductions. - Equipped with a 3D reconstruction analysis function to observe processing progress and conditions, addressing issues that arise during processing. ※Applications and Case Studies By increasing the amount of ion beam irradiated onto the sample, it is possible to etch the sample surface by increasing the number of sputtered atoms. This enables maskless processing that selectively etches only the areas exposed to the ion beam. By applying these technologies, it is possible to perform cross-sectional observation processing to expose and observe the cross-section of the sample, as well as to create TEM samples by extracting the sample as thin slices. Additionally, due to the very small focus diameter of the ion beam, which is on the order of tens of nanometers, it is possible to carry out sub-micron order processing such as hole processing with a diameter of less than 0.5 micrometers and slit (groove) processing with a width of less than 0.5 micrometers. We not only respond to your requests but also want to step into your concerns and solve them together. Please feel free to consult with us.

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*For more details, please contact us. You can also view application examples in the catalog through photographs.

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Focused Ion Beam Processing Observation Device

Focused Ion Beam Processing Observation Device

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Precision Machining Technology Handbook Vol. 1 [*Currently Available for Free!*]

Precision Machining Technology Handbook Vol. 1 [*Currently Available for Free!*]

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SIM Card 3D Reconstruction Analysis Outsourcing Service

SIM Card 3D Reconstruction Analysis Outsourcing Service

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Ultra-precision micro-hole processing technology

Ultra-precision micro-hole processing technology

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東レ・プレシジョン

東レ・プレシジョン

Machine elements and parts

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Precision micro-machining technology is increasingly recognized as a common foundational technology that supports modern advanced industries. Since its establishment in 1955, Toray Precision Co., Ltd. has manufactured spinnerets, which are key technologies for synthetic fiber production, and has contributed to the development of the synthetic fiber industry by providing them to fiber manufacturers worldwide, including Japan and Europe and the United States. Meanwhile, the experience and technology gained during this time in precision micro-machining have been widely applied to other industrial sectors. Precision machined components are incorporated into critical parts of aircraft, industrial robots, measurement and control equipment, etc. Additionally, the specially developed and designed fluid nozzles have demonstrated their functionality as important components in various industrial machines. The ultra-precision micro-machining technology, boasting sub-micron precision, is also utilized in the optical communication field, which is essential for realizing a highly information-oriented society. We have also commercialized various optical devices, including optical components such as ferrules and adapters. As a pioneer in ultra-precision micro-machining technology, we will continue to contribute to society by delivering high-precision, high-quality products.

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