High-quality, high-strength diamonds processed using special methods.
This is high-quality diamond for wire saws processed using a special method. The shape is regular, and the particle size is concentrated, making it ideal for cutting work. It has high strength due to the low amount of impurities. It possesses excellent dispersion and wear resistance.
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basic information
Particle size range: 5μm - 60μm
Price range
Delivery Time
Applications/Examples of results
It is used for processing, cutting, and polishing organic and inorganic materials. (For example, it is applied to cutting, grinding, and polishing high-end materials such as diamond wire, diamond rope, sapphire, quartz, optical measuring instruments, LED sapphire substrates, liquid crystal glass, and semiconductors.) *For more details, please contact us.*
Company information
Introducing semiconductor products from Russia, South Korea, and China.
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