Processing "wrap processing"

We also remove wire marks during rough processing to shape a clean surface! We accommodate necessary parts for mold components and machine parts.

We also accommodate the complex 3D irregular mirror finishing and the removal of micro burrs and edge finishing on outer surfaces that have been traditionally required! Sankō Seimitsu Co., Ltd. manufactures various precision mold components and molds, primarily for the semiconductor industry, at the entrance of the World Heritage Site, Mount Koya. We handle various inquiries and estimates for the manufacturing of various components (wire, milling, machining) and mold design. We can produce using 3D CAD data. No need to convert to 2D drawings, aiming for short delivery times. 【Features】 ○ Can be applied to hard materials ○ Removes wire marks during rough processing, forming a clean surface ○ In the state after finishing processing, it is truly a mirror surface For more details, please contact us. Contact us http://www.sankoseimitsu.co.jp/contact/ Or download the catalog.

Processing Contract