We can manufacture carriers with quality tailored to your requests! Here are examples of C-mount specifications.
The "Mount/Carrier" is a heat sink that can be used in markets and applications such as industrial lasers, optical communications, and digital devices. Our company can manufacture carriers of various qualities tailored to your needs, utilizing advanced technologies in-house, including shape processing, plating, vapor deposition, and soldering, from general-purpose C-mounts to fully customized products. 【Precision】 ■ Surface roughness: Ra<0.4 ■ Warpage: 5μm or less ■ Edge R: 10μm or less, 50μm or less, 80μm or less *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Materials】 ■Main body: Cu(OFHC)/CuW10 ■Leads: Kv, Cu, Mo ■Insulation: Al203 (92-96%) 【Metalization】 ■Overall: Ni 1.0-5.0μm/Au 0.1-0.3μm 【Other Options】 ■AuSn solder deposition ■Diamond turning finish (Cu type only) *For more details, please refer to the PDF document or feel free to contact us.
Price information
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Delivery Time
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Applications/Examples of results
【Applications】 ■ LD carriers for optical communication, PD carriers for optical communication ■ LD carriers for high power use *For more details, please refer to the PDF document or feel free to contact us.
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Company information
We will propose the most suitable solutions that match our customers' requirements, considering quality, cost, and mass production, through our advanced composite processing technology (Cross Edge Micro Machining), which combines five cutting-edge techniques: cutting, grinding, polishing, metalizing, and joining.