We provide a semiconductor development environment tailored to meet utilization needs!
The Fukuoka Prefectural Industrial and Scientific Technology Promotion Foundation's 3D Semiconductor Research Center is a facility equipped with implementation and evaluation equipment necessary to support research and development, prototyping, and evaluation for stacking multiple semiconductor chips in three dimensions to achieve high density in semiconductor-related products. With approximately 80 types of rental equipment available, we support the creation of new added value by combining each user's development themes with the foundational technologies of our center. 【Business Activities】 ○ Support for semiconductor design, implementation, prototyping, demonstration experiments, and evaluation ○ Provision of semiconductor development environments tailored to user needs For more details, please contact us or download the catalog.
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【Facility Overview】 ○ Standardization of SiP (System in Package) implementation boards (embedded component boards) *SiP: A system that encapsulates multiple LSI (Large Scale Integration) chips into a single package. ○ Dissemination of global standards and specifications (standardization of manufacturing methods, testing methods, etc.) ○ Prototype line for embedded component boards, which are advanced implementations ○ Support for high-density implementation (Class 1000 clean room) ○ Advanced analysis and evaluation equipment and sample processing facilities for analysis ○ Implementation equipment (including flip chip bonders) and evaluation equipment are provided ○ Incubation room ● For more details, please contact us or download the catalog.
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The Fukuoka Prefectural Industrial and Scientific Technology Promotion Foundation's Three-Dimensional Semiconductor Research Center has facilities that can design, manufacture, test, evaluate, and analyze embedded substrates with active and passive components wired in three dimensions within printed circuit boards at mass production levels. In addition to a standard printed circuit board manufacturing line, it is equipped with mounting devices for embedding components within the substrate and high-temperature, high-humidity vibration testing equipment to evaluate connection reliability. Furthermore, there is an 8-inch silicon wafer line that allows for the development of test element group (TEG) chips for evaluation. Additionally, it is possible to develop three-dimensional stacking of chips using through silicon vias (TSV) and silicon interposers that use silicon substrates instead of printed circuit boards.
