3D Semiconductor Research Center - Semiconductor-related Equipment and Facility Rental Business
We support the entire prototyping process!
The Fukuoka Prefectural Industrial and Scientific Technology Promotion Foundation's 3D Semiconductor Research Center offers paid rental of equipment and facilities for the prototyping of semiconductor-related products, including both front-end and back-end processes. In addition to equipment rental, we also provide support for the entire prototyping process. Please feel free to consult us about anything related to prototyping, including design, materials, processes, and evaluation. 【Features】 - By utilizing our center's foundational technologies and evaluation kits, you can shorten development time and reduce development costs. - The silicon processing and printed circuit board manufacturing processes are housed in a single building. - We actively challenge processes that cross the boundaries of front-end and back-end processes. - Even if you are using equipment for the first time, you can utilize it with support from specialized researchers. For more details, please contact us or download the catalog.
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basic information
【Equipment】 ○ Si Processing Steps (Front Process) → Fine Wiring Formation (0.35μm) → Si Hole Processing, Cutting, Grinding → Si Via Fill Plating → Insulation Film Formation, etc. ○ Printed Wiring and Embedded Component Boards (Back Process) → Direct Drawing Exposure → Machining, Laser Processing → Electrolytic and Electroless Plating → Component Mounting, etc. ○ Electrical Evaluation → Propagation Loss and Reflection Characteristics (TDR) → Electromagnetic Field Analysis (High-Frequency Characteristics) ○ Reliability Testing → Load Testing (Vibration, High Temperature, Low Temperature, Shock), etc. ○ Others → FESEM Observation → EDX Observation → X-ray Fluoroscopy Observation → FIB Observation, etc. ● For more details, please contact us or download the catalog.
Price information
Please refer to the official HP price list.
Delivery Time
※Please contact us.
Applications/Examples of results
【Purpose】 ○ Prototyping of semiconductor-related products, etc. ● For more details, please contact us or download the catalog.
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Company information
The Fukuoka Prefectural Industrial and Scientific Technology Promotion Foundation's Three-Dimensional Semiconductor Research Center has facilities that can design, manufacture, test, evaluate, and analyze embedded substrates with active and passive components wired in three dimensions within printed circuit boards at mass production levels. In addition to a standard printed circuit board manufacturing line, it is equipped with mounting devices for embedding components within the substrate and high-temperature, high-humidity vibration testing equipment to evaluate connection reliability. Furthermore, there is an 8-inch silicon wafer line that allows for the development of test element group (TEG) chips for evaluation. Additionally, it is possible to develop three-dimensional stacking of chips using through silicon vias (TSV) and silicon interposers that use silicon substrates instead of printed circuit boards.